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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6818 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 1/4 HMBT4403 PNP EPITAXIAL PLANAR TRANSISTOR Description The HMBT4403 is designed for general purpose applications requiring high breakdown voltages. Absolute Maximum Ratings SOT-23 * Maximum Temperatures Storage Temperature ........................................................................................... -55 ~ +150 C Junction Temperature.................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 225 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ........................................................................................ -40 V VCEO Collector to Emitter Voltage..................................................................................... -40 V VEBO Emitter to Base Voltage............................................................................................. -5 V IC Collector Current....................................................................................................... -600 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICEX *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 *hFE4 *hFE5 fT Cob Min. -40 -40 -5 30 60 100 100 20 200 Typ. Max. -100 -400 -750 -950 -1.3 300 8.5 Unit V V V nA mV mV mV V Test Conditions IC=-100uA IC=-1mA IE=-100uA VCE=-35V, VBE=-0.4V IC=-150mA, IB=-15mA IC=-500mA, IB=-50mA IC=-150mA, IB=-15mA IC=-500mA, IB=-50mA VCE=-1V, IC=-0.1mA VCE=-1V, IC=-1mA VCE=-1V, IC=-10mA VCE=-2V, IC=-150mA VCE=-2V, IC=-500mA VCE=-10V, IC=-20mA, f=100MHz VCB=-10V, f=1MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz pF HMBT4403 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 Spec. No. : HE6818 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 2/4 Current Gain & Collector Current 125 C o 125 C o 25 C o 25 C o hFE hFE 100 75 C o 100 75 C o hFE @ VCE=1V hFE @ VCE=2V 10 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 VCE(sat) @ IC=10IB 1000 Saturation Voltage & Collector Current 25 C o Saturation Voltage (mV) Saturation Voltage (mV) 75 C 125 C o o 100 75 C o o 125 C 25 C o VBE(sat) @ IC=10IB 10 0.1 1 10 100 1000 100 0.1 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Capacitance & Reverse-Biased Voltage 100 1000 Cutoff Frequency & Collector Current Cutoff Frequency (MHz).. . VCE=10V Capacitance (pF) Cob 10 100 1 0.1 1 10 100 10 1 10 100 1000 Reverse Biased Voltage (V) Collector Current (mA) HMBT4403 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6818 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 3/4 Safe Operating Area 10 PT=1ms Collector Current-IC (mA) 1 PT=100ms PT=1s 0.1 0.01 1 10 100 Forward Biased Voltage-VCE (V) HMBT4403 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-23 Dimension Spec. No. : HE6818 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 4/4 A L Marking: 3 BS 1 V G 2 2T Rank Code Control Code 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N C D H K J Style: Pin 1.Base 2.Emitter 3.Collector *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Te : 886-3-5983621~5 Fax: 886-3-5982931 HMBT4403 HSMC Product Specification |
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